Pore characterization of ultralow-k dielectric thin films using positronium annihilation spectroscopy. Ming Liu

ISBN: 9780549986751

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246 pages


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Pore characterization of ultralow-k dielectric thin films using positronium annihilation spectroscopy.  by  Ming Liu

Pore characterization of ultralow-k dielectric thin films using positronium annihilation spectroscopy. by Ming Liu
| NOOKstudy eTextbook | PDF, EPUB, FB2, DjVu, audiobook, mp3, RTF | 246 pages | ISBN: 9780549986751 | 6.16 Mb

In this thesis, a series of nanoporous ultralow dielectric constant (ULK) thin films fabricated using spin-coating and sacrificial pore generators (degradable porogens embedded in a host matrix) were studied as a function of porogen concentration andMoreIn this thesis, a series of nanoporous ultralow dielectric constant (ULK) thin films fabricated using spin-coating and sacrificial pore generators (degradable porogens embedded in a host matrix) were studied as a function of porogen concentration and hence porosity to systematically vary the porogen-porogen and the porogen-matrix interactions.

After porogen removal the resulting pore size and pore interconnectivity were characterized by beam-based (depth-profiled) Positronium Annihilation Lifetime Spectroscopy (PALS).-In a film series fabricated with the same methyl-silsesquioxane (MSQ)-based matrix, specific porogen-porogen interactions were induced by different functional end-groups of cyclodextrin (CD) porogens and by amphiphilicity of a calix-arene (CA[6]) porogen.

Random, linear, and self-assembly growth modes respectively for the tCD, sCD and CA porogen domains were distinguished by PALS depth-profiling. In a sample series fabricated using the sanie nucleation and growth (N&G) porogen and different MSQ-based matrices, distinct porogen-induced pore structures were observed which exhibit the significant role of porogen-matrix interactions in determining the pore morphology.

Furthermore, in-situ thermal curing of nanocomposite hybrid samples to form nanoporous materials extends ones understanding of microphase separation, porogen degradation, and pore structure evolution with curing temperatures.-Monte Carlo simulations were conducted on a three dimensional cubic lattice to simulate the evolution of pore size and pore interconnectivity with increasing porosity. The calculated pore size evolution was found to be very consistent with the experimental results. The calculated pore interconnection length, while consistent with simple percolation concepts, did not follow the typical quadratic growth with porosity observed with PALS.

The positronium annihilation intensity in the porogen-induced pores was simulated and compared with experiment. Such measurements appear to be promising as an absolute porosity calibration.-In an effort to successfully integrate ULK materials, chemical vapor deposited (CVD) Parylene-N has been found to be an effective sealant for interconnected pores to prevent copper diffusion and moisture uptake. However, in a depth-profiling experiment using PALS, it was found to penetrate the film to a depth of ∼200 nm.

Characterization of penetrants in permeable systems is a broad area with a promising future for PALS applications.



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